Samsung announced an updated version of its 16 Gb DDR5 DRAM today. The memory is built on the 12nm class process technology, upgrading from the 14nm EUV product currently on the market.
The new DDR5 DRAM was also announced to be compatible with AMD products – it was optimized and validated on Zen platforms.
Jooyoung Lee, EVP of DRAM Product & Technology at Samsung, said that the new standard would be a key enabler in driving a market-wide adoption of DDR5 DRAM.
It is manufactured with the use of a new material that increases cell capacitance and proprietary design technology that improves critical circuit characteristics.
The new DRAM is based on EUV (Extreme ultraviolet) lithography, allowing a higher die density and 20% better wafer productivity. It also consumes 23% less power, opening the door for better environment-friendly operations among IT companies.
The first memory sticks with the new DDR5 DRAM are expected to start shipping in 2023.
